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<p>Science-based approaches to the production of soft polishing materials for chemical mechanical planarization of dielectric layers of semiconductor silicon wafers were proposed. A flexible material based on nonwoven fabric soaked with a polyurethane solution and additionally treated with a solvent-precipitant mixture to provide a binder film distributed on the fibers was developed.</p>

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Development of Polishing Materials Based on Nonwoven Matrices and Polyesterurethane Solutions for Chemical Mechanical Planarization of Dielectric Layers of Semiconductor Wafers

  • 期刊论文

  • 发表日期：

    2025年3月1日

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  • E. S. Bokova,
  • D. I. Terashkevich,
  • D. S. Plotnikov,
  • G. M. Kovalenko

摘要

Science-based approaches to the production of soft polishing materials for chemical mechanical planarization of dielectric layers of semiconductor silicon wafers were proposed. A flexible material based on nonwoven fabric soaked with a polyurethane solution and additionally treated with a solvent-precipitant mixture to provide a binder film distributed on the fibers was developed.