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<p>Integrating inorganic fillers into polymer-based 3D printing filaments is an effective strategy for improving thermal conduction but often compromises mechanical properties. In this study, we introduced electrospun polymer nanofibers (NF) into thermoplastic polyurethane (TPU) filaments alongside a ceramic filler, boron nitride (BN). By combining these organic (NF) and inorganic (BN) fillers, we created a dual-filler filament (TPU/BN/NF) that exhibited enhanced thermal conduction pathways without sacrificing the mechanical strength and electrical insulation. Comprehensive characterization demonstrated that BN improved heat transport, while a small fraction of electrospun NF effectively modulated the tensile modulus and partially recovered the strength lost upon BN addition. Finite element simulations further elucidated the influence of the nanofiber content, orientation, and length-to-diameter ratio on the mechanical performance. Notably, the dual-filler filaments retained good printability in standard fused deposition modeling (FDM) systems at optimized temperatures (about 210 °C). These findings offer a scalable approach for engineer multifunctional 3D printing filaments for 3D-printed thermal management products that require both thermal conduction performance and high insulation.</p>

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Development of Organic-Inorganic High Thermal Performance Composites Reinforced with Nanofibers for 3D Printing

  • 期刊论文

  • 发表日期：

    2026年3月2日

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  • Tian-Hong Lang,
  • Lu Tong,
  • Li-Xue Yang,
  • Ze-Yi Chen,
  • De-Chi Qi,
  • Yi-Bin Dong,
  • Zheng Sun,
  • Qing Li,
  • Xiao-Fei Song,
  • Jiu-Ke Mu

摘要

Integrating inorganic fillers into polymer-based 3D printing filaments is an effective strategy for improving thermal conduction but often compromises mechanical properties. In this study, we introduced electrospun polymer nanofibers (NF) into thermoplastic polyurethane (TPU) filaments alongside a ceramic filler, boron nitride (BN). By combining these organic (NF) and inorganic (BN) fillers, we created a dual-filler filament (TPU/BN/NF) that exhibited enhanced thermal conduction pathways without sacrificing the mechanical strength and electrical insulation. Comprehensive characterization demonstrated that BN improved heat transport, while a small fraction of electrospun NF effectively modulated the tensile modulus and partially recovered the strength lost upon BN addition. Finite element simulations further elucidated the influence of the nanofiber content, orientation, and length-to-diameter ratio on the mechanical performance. Notably, the dual-filler filaments retained good printability in standard fused deposition modeling (FDM) systems at optimized temperatures (about 210 °C). These findings offer a scalable approach for engineer multifunctional 3D printing filaments for 3D-printed thermal management products that require both thermal conduction performance and high insulation.