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<p>A binder-assisted electroplating process is reported for the fabrication of porous copper electrodes in a room-temperature aqueous sulfate bath. A precursor layer composed of copper powder and a sodium alginate binder was deposited on an electroless-Cu-coated substrate, and electrolytic copper plating was carried out at room temperature in a sulfate bath. Cross-sectional scanning electron microscopy revealed that, in the early stage of plating, electrodeposited copper formed bridges at interparticle contact points, producing an interconnected three-dimensional network <sub>dl</sub>) obtained from cyclic voltammetry in the non-Faradaic region in 0.1&#xa0;mol L<sup>− 1</sup> Na<sub>2</sub>SO<sub>4</sub> (pH 4). The C<sub>dl</sub> values were 1.09 × 10<sup>− 2</sup>, 2.32, and 1.94 mF cm<sup>− 2</sup> for a flat Cu plate, the 5&#xa0;min porous Cu, and the 30&#xa0;min porous Cu, respectively, corresponding to relative increases of approximately 213-fold and 178-fold over the flat reference. These results are consistent with the formation of an electrolyte-accessible porous Cu network by binder-assisted electroplating; quantitative comparison with other porous Cu fabrication routes is beyond the scope of this communication. Linear sweep voltammetry and impedance measurements in 0.1&#xa0;mol L<sup>− 1</sup> Na<sub>2</sub>SO<sub>4</sub> (pH 4) showed a negatively shifted anodic dissolution onset for the porous electrode and a distributed, porous-electrode impedance response.&#xa0;</p> Graphical Abstract <p></p>

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Binder-assisted electroplating of porous copper: formation of an interconnected network with enhanced electrolyte-accessible interfacial area

  • 期刊论文

  • 发表日期：

    2026年7月22日

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  • Isao Shitanda,
  • Natsumi Fujiwara,
  • Tomoharu Shiozawa,
  • Michiko Tagaya,
  • Masahiro Yoshino,
  • Hikari Watanabe,
  • Masayuki Itagaki

摘要

A binder-assisted electroplating process is reported for the fabrication of porous copper electrodes in a room-temperature aqueous sulfate bath. A precursor layer composed of copper powder and a sodium alginate binder was deposited on an electroless-Cu-coated substrate, and electrolytic copper plating was carried out at room temperature in a sulfate bath. Cross-sectional scanning electron microscopy revealed that, in the early stage of plating, electrodeposited copper formed bridges at interparticle contact points, producing an interconnected three-dimensional network dl) obtained from cyclic voltammetry in the non-Faradaic region in 0.1 mol L− 1 Na2SO4 (pH 4). The Cdl values were 1.09 × 10− 2, 2.32, and 1.94 mF cm− 2 for a flat Cu plate, the 5 min porous Cu, and the 30 min porous Cu, respectively, corresponding to relative increases of approximately 213-fold and 178-fold over the flat reference. These results are consistent with the formation of an electrolyte-accessible porous Cu network by binder-assisted electroplating; quantitative comparison with other porous Cu fabrication routes is beyond the scope of this communication. Linear sweep voltammetry and impedance measurements in 0.1 mol L− 1 Na2SO4 (pH 4) showed a negatively shifted anodic dissolution onset for the porous electrode and a distributed, porous-electrode impedance response. 

Graphical Abstract