<p>Rapid heating technology (e.g., laser lithography) has been extensively applied in the micro-machining of semiconductor device, of which the nonlocal deformation and the micro-nanoscale dual-phase-lagging behavior of heat transfer significantly increases. To characterize such multi-physics coupling phenomenon, this paper aims to establish a new photo-thermoelastic model based on the mixed nonlocal dual-phase-lag heat conduction law and Eringen’s nonlocal elasticity theory, of which the novelty is the spatial nonlocal effects and dual-phase-lagging heat conduction mechanism are simultaneously considered. The newly developed model is applied to investigate the transient response of the one-dimensional (1D) semiconducting plate, and the time-domain solutions of the 1D multi-variables partial differential equations are solved via semi-analytical technique based on the Laplace transformation. The dimensionless numerical results show that the increasing spatial/temporal scale parameters of the mixed nonlocal dual-phase-lag model characterize the thermal wave phenomenon and faster heat propagation speed. Accordingly, the carrier concentration becomes lager, improving the semiconductor conductivity and performance, and reducing the large deformation and stress concentration in the semiconductor plate.</p>