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<p>Visualization of fingerprints on irregular metal objects is crucial in forensic practice, and electrochemical deposition of copper films provides a simple and effective solution in this regard. Latent fingerprints were visualized by chronoamperometric reduction of Cu<sup>2</sup>⁺ from a 0.02&#xa0;M copper sulfate solution in 0.1&#xa0;M sulfuric acid. The deposition parameters were optimized for stainless-steel (−0.450&#xa0;V vs. Ag/AgCl, 180&#xa0;s) and brass (−0.250&#xa0;V vs. Ag/AgCl, 120&#xa0;s) and successfully applied to real objects (coins, keys, and cartridge cases). Fingerprint details were evaluated using a stereoscopic microscope. All samples showed fingerprint quality suitable for identification. The method is fast, cost-effective, and applicable to curved or irregular surfaces, making it a promising tool for practical forensic applications. </p> Graphical Abstract <p></p>

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Electrochemical enhancement of latent fingerprints using copper film deposition on metal objects

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2025年8月3日

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  • Adéla Šrámková,
  • Sára Hermochová,
  • Kristýna Havelková,
  • Petr Vrablic,
  • Gabriela Broncová

摘要

Visualization of fingerprints on irregular metal objects is crucial in forensic practice, and electrochemical deposition of copper films provides a simple and effective solution in this regard. Latent fingerprints were visualized by chronoamperometric reduction of Cu2⁺ from a 0.02 M copper sulfate solution in 0.1 M sulfuric acid. The deposition parameters were optimized for stainless-steel (−0.450 V vs. Ag/AgCl, 180 s) and brass (−0.250 V vs. Ag/AgCl, 120 s) and successfully applied to real objects (coins, keys, and cartridge cases). Fingerprint details were evaluated using a stereoscopic microscope. All samples showed fingerprint quality suitable for identification. The method is fast, cost-effective, and applicable to curved or irregular surfaces, making it a promising tool for practical forensic applications.

Graphical Abstract