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<p>The relentless miniaturization and high-density integration of power electronics have rendered heat dissipation a critical bottleneck, compromising device performance and stability. Microchannel heat sinks represent a promising technology for managing high-heat-flux devices. A number of studies propose using diamond to fabricate microchannel heat sinks, capitalizing on its exceptional thermal conductivity to enhance heat dissipation. However, the prohibitive cumulative costs associated with fabricating, micro-machining, and finishing monolithic diamond microchannel heat sinks preclude widespread adoption. This study introduces a cost-effective shim-based microchannel heat sink architecture for high-power device thermal management. This novel structure eliminates expensive diamond micro-structuring by stacking prefabricated diamond shims at defined intervals, reducing manufacturing costs by 55–61% compared to integral and hybrid diamond microchannel heat sinks. At Reynolds number of 320, bottom surface maximum temperature is just 8.8&#xa0;K higher than integral microchannel heat sink. Bottom surface maximum temperature goes down from 357.4 to 337.2&#xa0;K when grease thermal conductivity goes up from 1 to 6&#xa0;W/m·K. Grease thickness 10–60&#xa0;μm changes bottom surface max temperature from 331.3 to 345.4&#xa0;K, and Reynolds number 80 to 640 changes it from 361.5 to 339.1&#xa0;K. As such, this work provides valuable insights for developing cost-effective, high-performance thermal solutions for high-heat-flux devices and will further advance the application of diamond-based materials in thermal management of high-power electronic devices.</p>

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Development of a cost-effective diamond shim-based microchannel heat sink for power devices

  • 期刊论文

  • 发表日期：

    2026年2月23日

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  • Yaohua Li,
  • Yingxue Qian

摘要

The relentless miniaturization and high-density integration of power electronics have rendered heat dissipation a critical bottleneck, compromising device performance and stability. Microchannel heat sinks represent a promising technology for managing high-heat-flux devices. A number of studies propose using diamond to fabricate microchannel heat sinks, capitalizing on its exceptional thermal conductivity to enhance heat dissipation. However, the prohibitive cumulative costs associated with fabricating, micro-machining, and finishing monolithic diamond microchannel heat sinks preclude widespread adoption. This study introduces a cost-effective shim-based microchannel heat sink architecture for high-power device thermal management. This novel structure eliminates expensive diamond micro-structuring by stacking prefabricated diamond shims at defined intervals, reducing manufacturing costs by 55–61% compared to integral and hybrid diamond microchannel heat sinks. At Reynolds number of 320, bottom surface maximum temperature is just 8.8 K higher than integral microchannel heat sink. Bottom surface maximum temperature goes down from 357.4 to 337.2 K when grease thermal conductivity goes up from 1 to 6 W/m·K. Grease thickness 10–60 μm changes bottom surface max temperature from 331.3 to 345.4 K, and Reynolds number 80 to 640 changes it from 361.5 to 339.1 K. As such, this work provides valuable insights for developing cost-effective, high-performance thermal solutions for high-heat-flux devices and will further advance the application of diamond-based materials in thermal management of high-power electronic devices.