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<p>During the last three decades, the demand for means of highly efficient heat dissipation has increased dramatically with the development of electronic devices towards slimness, high power density, and miniaturization. Microchannel heat sinks (MCHS), with their highly efficient, thermal load-bearing capacity, have emerged as a reliable solution for enhancing heat dissipation. Recent research on MCHS has focused on optimizing their microchannel structures, enhancing their internal flow dynamics, improving their surface treatments, and developing new materials to enhance their performance. Herein, we combine composite electrodeposition and UV-LIGA techniques to fabricate a microchannel heat transfer in copper matrix composites reinforced with SiC whiskers. We established a simulation model to conduct experimental and numerical studies on the heat transfer characteristics of the fabricated microchannel. Notably, the calculated heat dissipation efficiency (1162&#xa0;W/cm<sup>2</sup>) closely matched the experimental data of the fabricated sample (approximately 1105&#xa0;W/cm<sup>2</sup>), confirming the model’s validity in simulating the heat transfer process. In addition, simulations of parameters, such as reinforcement volume fraction, heat sink height, and turbulator columns, demonstrated that the thermal conductivity of the composite material significantly influences the heat dissipation efficiency of the heat sink. The originality of this work lies then in its Silicon carbide whisker reinforced copper based composite material. It provides a promising approach to advancing chip cooling technologies and a scalable solution for improving heat dissipation efficiency.</p>

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Experimental and numerical investigation on microchannel heat transfer in copper matrix composites reinforced with SiC whiskers

  • 期刊论文

  • 发表日期：

    2026年2月20日

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  • Liyan Lai,
  • Yuxiao Bi,
  • Feng Qian,
  • Guilian Wang,
  • Yigui Li,
  • Guifu Ding

摘要

During the last three decades, the demand for means of highly efficient heat dissipation has increased dramatically with the development of electronic devices towards slimness, high power density, and miniaturization. Microchannel heat sinks (MCHS), with their highly efficient, thermal load-bearing capacity, have emerged as a reliable solution for enhancing heat dissipation. Recent research on MCHS has focused on optimizing their microchannel structures, enhancing their internal flow dynamics, improving their surface treatments, and developing new materials to enhance their performance. Herein, we combine composite electrodeposition and UV-LIGA techniques to fabricate a microchannel heat transfer in copper matrix composites reinforced with SiC whiskers. We established a simulation model to conduct experimental and numerical studies on the heat transfer characteristics of the fabricated microchannel. Notably, the calculated heat dissipation efficiency (1162 W/cm2) closely matched the experimental data of the fabricated sample (approximately 1105 W/cm2), confirming the model’s validity in simulating the heat transfer process. In addition, simulations of parameters, such as reinforcement volume fraction, heat sink height, and turbulator columns, demonstrated that the thermal conductivity of the composite material significantly influences the heat dissipation efficiency of the heat sink. The originality of this work lies then in its Silicon carbide whisker reinforced copper based composite material. It provides a promising approach to advancing chip cooling technologies and a scalable solution for improving heat dissipation efficiency.