Scholarlink

<p>This study investigates cooling characteristics of electronic components integrated to a way-shaped canopy swayed by the forced convective air flow. Aluminum foam that is extremely conductive is used to cover the heat-generating component. The numerical framework developed in this endeavor takes into account the impact of conjugate transport of heat in the copper base and convective heat transport with ambient with plastic cover. Using the Darcy extended Brinkman–Forchheimer model to describe the flow field underneath the porous aluminum foam. By altering the pore size, simulations are performed to obtain the flow field, heat flux lines, maximum temperature rise, cooling performance, relative pressure drop, and thermal entropy formation. It has been seen that the distinct flow topology in the wavy channel, mainly stimulated by the additional vortices that form there compared to channel with plane wall, modifies the associated heat lines. Consequently, for a given flow condition, the usage of wavy wall permits approximately a 5&#xa0;K drop in maximum temperature when compared to channel having plane wall. A larger pore size improves cooling performance because the wavy channel experiences a smaller relative pressure drop. Furthermore, the entropy generation owing to the thermal transport of heat is smaller in wavy channels and decreases gradually as pore size increases. Derived insights of this analysis are expected to have significant impact on designing cost-effective electronic cooling systems.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Augmented electronic cooling strategy: effect of foam pore size for forced convective flow through wavy canopy

  • 期刊论文

  • 发表日期：

    2025年1月13日

查看全文
  • Debarthy Deb,
  • Sumit Kumar Mehta,
  • Somchai Wongwises,
  • Pranab Kumar Mondal

摘要

This study investigates cooling characteristics of electronic components integrated to a way-shaped canopy swayed by the forced convective air flow. Aluminum foam that is extremely conductive is used to cover the heat-generating component. The numerical framework developed in this endeavor takes into account the impact of conjugate transport of heat in the copper base and convective heat transport with ambient with plastic cover. Using the Darcy extended Brinkman–Forchheimer model to describe the flow field underneath the porous aluminum foam. By altering the pore size, simulations are performed to obtain the flow field, heat flux lines, maximum temperature rise, cooling performance, relative pressure drop, and thermal entropy formation. It has been seen that the distinct flow topology in the wavy channel, mainly stimulated by the additional vortices that form there compared to channel with plane wall, modifies the associated heat lines. Consequently, for a given flow condition, the usage of wavy wall permits approximately a 5 K drop in maximum temperature when compared to channel having plane wall. A larger pore size improves cooling performance because the wavy channel experiences a smaller relative pressure drop. Furthermore, the entropy generation owing to the thermal transport of heat is smaller in wavy channels and decreases gradually as pore size increases. Derived insights of this analysis are expected to have significant impact on designing cost-effective electronic cooling systems.