Mechanism of temperature-induced electromechanical interactions and sensing optimization in a piezoelectric semiconductor cylindrical shell
摘要
Electromechanical behaviors of piezoelectric semiconductors (PSs) are sensitive to temperature changes. High-temperature environment monitoring and human body temperature assessment are just some of the possible applications of this phenomenon. This paper presents a theoretical study on temperature-induced electromechanical interactions in a piezoelectric semiconductor cylindrical shell (PSCS) within the first-order shear deformation theory of shells. Temperature variations are coupled into the derived two-dimensional equations via thermoelasticity and pyroelectricity. The mathematical outcomes reveal that the distribution of displacements, electric potentials, and mobile charges in the shell can be manipulated by the temperature field. Our research systematically investigates the effects of thermoelasticity, pyroelectricity, and doping levels on charge redistributions across the PSCS. Furthermore, a comparative analysis between analytical and finite element solutions demonstrates remarkable agreement. For the optimized design of temperature-sensing applications, the multi-field coupling responses of the PSCS are numerically analyzed under array-based temperature fields, considering various distributions of thermal loading regions and boundary conditions. The advancements presented here hold great promise for the design and optimization of PS temperature sensors within shell configurations.