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<p>Laser ablation for creating microstructures on diamond surfaces serves as an effective strategy to address the heat dissipation issues in high-heat-flux electronic devices. Achieving uniform ablation on diamond surfaces is crucial for fabricating such microstructures. This study employs a low-cost laser processing technique combined with CNC software to fabricate high-precision microstructures with limited heat-affected zones on polycrystalline diamond surfaces. The ablation mechanisms and quantitative material removal of three differently oriented single-crystal diamonds were characterized using confocal laser scanning microscopy and molecular dynamics simulations. Results indicate that the (111)-oriented single-crystal diamond exhibits the highest removal volume of 1.0 × 10¹⁵ nm³, followed by the (110) orientation with 7.5 × 10¹⁴ nm³, and the (100) orientation with the smallest removal volume of only 6.2 × 10¹⁴ nm³. Additionally, the grain orientation of polycrystalline diamond and the morphological evolution after ablation were investigated using Raman spectroscopy, electron backscatter diffraction, and atomic force microscopy. The removal volume follows the order of (111) &gt;(110) &gt;(100), which is consistent with the experimental results from single-crystal diamonds. Based on these findings, a laser processing strategy was developed by pre-characterizing grain orientations and adjusting laser energy via CNC programming to compensate for removal volume differences caused by crystallographic orientations. This method effectively suppresses “over-ablation” and “non-uniform ablation,” thereby improving the surface flatness of the processed areas. This study not only deepens the understanding of the laser ablation mechanism on diamond but also provides a feasible solution for high-quality and high-precision micro-processing of diamond.</p>

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Effects of CVD diamond orientation and grain boundaries on amount of laser ablation

  • 期刊论文

  • 发表日期：

    2026年1月5日

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  • Kang An,
  • Guangyu Xu,
  • Shiyu Li,
  • Peng Liu,
  • Lijun Li,
  • Haiping Wu,
  • Yongkang Zhang,
  • Yachen Zhang,
  • Hong Li,
  • Fengbin Liu,
  • Chengming Li

摘要

Laser ablation for creating microstructures on diamond surfaces serves as an effective strategy to address the heat dissipation issues in high-heat-flux electronic devices. Achieving uniform ablation on diamond surfaces is crucial for fabricating such microstructures. This study employs a low-cost laser processing technique combined with CNC software to fabricate high-precision microstructures with limited heat-affected zones on polycrystalline diamond surfaces. The ablation mechanisms and quantitative material removal of three differently oriented single-crystal diamonds were characterized using confocal laser scanning microscopy and molecular dynamics simulations. Results indicate that the (111)-oriented single-crystal diamond exhibits the highest removal volume of 1.0 × 10¹⁵ nm³, followed by the (110) orientation with 7.5 × 10¹⁴ nm³, and the (100) orientation with the smallest removal volume of only 6.2 × 10¹⁴ nm³. Additionally, the grain orientation of polycrystalline diamond and the morphological evolution after ablation were investigated using Raman spectroscopy, electron backscatter diffraction, and atomic force microscopy. The removal volume follows the order of (111) >(110) >(100), which is consistent with the experimental results from single-crystal diamonds. Based on these findings, a laser processing strategy was developed by pre-characterizing grain orientations and adjusting laser energy via CNC programming to compensate for removal volume differences caused by crystallographic orientations. This method effectively suppresses “over-ablation” and “non-uniform ablation,” thereby improving the surface flatness of the processed areas. This study not only deepens the understanding of the laser ablation mechanism on diamond but also provides a feasible solution for high-quality and high-precision micro-processing of diamond.