Scholarlink

<p>Due to challenges and low efficiency in processing single-crystal diamonds, its large-scale application has been limited. However, laser processing emerges as an effective method for diamond machining, where the laser pulse width plays a crucial role in determining processing efficiency and quality. In this study, we utilized lasers with different pulse widths ranging from 300&#xa0;fs to 3&#xa0;ps, to perform microgrooving on the surface of a single-crystal diamond. Our research focused on evaluating various aspects, including the ablation threshold, material removal rate (MRR), microgroove dimensions, surface morphology, bottom region roughness, and material removal mechanisms of single-crystal diamonds under different laser pulse widths. The primary objective was to investigate the processing characteristics and the corresponding variations of single-crystal diamonds under these different laser pulse width conditions. The results of our study reveal that ultra-short pulse lasers with varying pulse widths significantly influence the ablation threshold, MRR, microgroove dimensions, surface morphology, and roughness of diamonds through their peak power. Remarkably, reducing the laser pulse width from 3&#xa0;ps to 300&#xa0;fs resulted in an impressive 75% decrease in the diamond ablation threshold. Additionally, the microgroove dimensions and <i>MRR</i> demonstrated gradual increments. Particularly, during the high average power stage, the influence of pulse width on groove depth and <i>MRR</i> became more pronounced due to incubation effects and plasma shielding. Another notable finding was the evolution of the surface morphology of diamond microgrooves, transitioning from periodic ripple structures to the appearance of damage, cracks, and even microgroove fragmentation. Moreover, the roughness (Rz) of the microgroove bottom region increased from 40 to 264&#xa0;nm. While the effect of laser pulse width on the material removal mechanism of diamond was relatively weak, it was observed to induce less subsurface damage (sp<sup>3</sup> + sp<sup>2</sup>). Additionally, in our experimental conditions, we detected the involvement of oxygen in the laser processing of diamonds. However, the main material removal mechanisms were identified to be evaporation or sublimation.</p> Graphical abstract <p></p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Study on laser processing characteristics of single-crystal diamond with different pulse widths

  • 期刊论文

  • 发表日期：

    2025年4月1日

查看全文
  • Jiancai Zhang,
  • Jiadong Lan,
  • Jiabin Lu,
  • Ziyuan Luo,
  • Qiusheng Yan,
  • Shaolin Xu

摘要

Due to challenges and low efficiency in processing single-crystal diamonds, its large-scale application has been limited. However, laser processing emerges as an effective method for diamond machining, where the laser pulse width plays a crucial role in determining processing efficiency and quality. In this study, we utilized lasers with different pulse widths ranging from 300 fs to 3 ps, to perform microgrooving on the surface of a single-crystal diamond. Our research focused on evaluating various aspects, including the ablation threshold, material removal rate (MRR), microgroove dimensions, surface morphology, bottom region roughness, and material removal mechanisms of single-crystal diamonds under different laser pulse widths. The primary objective was to investigate the processing characteristics and the corresponding variations of single-crystal diamonds under these different laser pulse width conditions. The results of our study reveal that ultra-short pulse lasers with varying pulse widths significantly influence the ablation threshold, MRR, microgroove dimensions, surface morphology, and roughness of diamonds through their peak power. Remarkably, reducing the laser pulse width from 3 ps to 300 fs resulted in an impressive 75% decrease in the diamond ablation threshold. Additionally, the microgroove dimensions and MRR demonstrated gradual increments. Particularly, during the high average power stage, the influence of pulse width on groove depth and MRR became more pronounced due to incubation effects and plasma shielding. Another notable finding was the evolution of the surface morphology of diamond microgrooves, transitioning from periodic ripple structures to the appearance of damage, cracks, and even microgroove fragmentation. Moreover, the roughness (Rz) of the microgroove bottom region increased from 40 to 264 nm. While the effect of laser pulse width on the material removal mechanism of diamond was relatively weak, it was observed to induce less subsurface damage (sp3 + sp2). Additionally, in our experimental conditions, we detected the involvement of oxygen in the laser processing of diamonds. However, the main material removal mechanisms were identified to be evaporation or sublimation.

Graphical abstract