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<p>Rational design of thermoplastic composites exhibiting temperature-stable dielectric response and minimized thermal expansion holds significant technological importance for advanced electrical and electronic applications. This study demonstrates a novel strategy to attain these aims through the integration of copper vanadate (β-Cu<sub>2</sub>V<sub>2</sub>O<sub>7</sub>) particles into linear low-density polyethylene matrix. The optimized composite films exhibit good thermal stability of dielectric constant over a broad temperature range (20–120&#xa0;°C), suppressed thermal expansion, and good melt-reprocessability. The synergy of phase stability and optimized filler–polymer interactions underpins the temperature-stable dielectric response. The negative thermal expansion characteristics of β-Cu<sub>2</sub>V<sub>2</sub>O<sub>7</sub> enable realization of dimensional stability. Such unique property combination addresses critical material requirements for electronic components operating under thermal cycling conditions, particularly in energy transmission systems and electronic packaging.</p>

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Temperature-stable dielectric constant and low thermal expansion in linear low-density polyethylene/copper vanadate composites

  • 期刊论文

  • 发表日期：

    2025年4月18日

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  • Hairong Li,
  • Wei Sun,
  • Beilin Qiu,
  • Yu Peng,
  • Aihua Xu,
  • Danding Li,
  • Yang Zhang,
  • Junlong Yao,
  • Ming Jiang

摘要

Rational design of thermoplastic composites exhibiting temperature-stable dielectric response and minimized thermal expansion holds significant technological importance for advanced electrical and electronic applications. This study demonstrates a novel strategy to attain these aims through the integration of copper vanadate (β-Cu2V2O7) particles into linear low-density polyethylene matrix. The optimized composite films exhibit good thermal stability of dielectric constant over a broad temperature range (20–120 °C), suppressed thermal expansion, and good melt-reprocessability. The synergy of phase stability and optimized filler–polymer interactions underpins the temperature-stable dielectric response. The negative thermal expansion characteristics of β-Cu2V2O7 enable realization of dimensional stability. Such unique property combination addresses critical material requirements for electronic components operating under thermal cycling conditions, particularly in energy transmission systems and electronic packaging.