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<p>Modern electronic devices contain heat-generating microelectronic components that are typically exposed to high energy levels. These devices require rapid heat dissipation. However, to enhance the system’s heat management capabilities, significant efforts are needed to develop high-performance heat-transfer fluids. This experimental study explored the thermal performance of a copper minichannel heat sink using four nanofluids: TiO₂–water, Al₂O₃–water, MgO–water, and ZnO–water. The comparative thermal performance of a copper minichannel heat sink (30&#xa0;mm × 30&#xa0;mm × 4&#xa0;mm) was evaluated under laminar flow conditions with nanofluids at volume fractions from 0.5% to 2.5%. A 7.93% enhancement in thermal conductivity was attained by dispersing Al₂O₃ nanoparticles at a 2.5% particle volume concentration in water. The Al₂O₃–water nanofluid demonstrated superior performance by reducing thermal resistance and friction factor in comparison to other nanofluids. The highest heat flux of 195.22&#xa0;kW/m² was achieved by the Al₂O₃–water nanofluid at a 2.5% volume fraction and an inlet velocity of 0.1&#xa0;m/s. Similarly, the lowest pressure drop and pumping power were 84.4&#xa0;Pa and 0.00025&#xa0;W, respectively. The comparative analysis showed that the Al₂O₃–water nanofluid exhibited better heat transfer performance and can be used as an effective minichannel heat sinks coolant for enhanced cooling applications.</p>

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Experiential study of nanofluids’ thermo-physical characteristics and heat transfer in a mini channel

  • 期刊论文

  • 发表日期：

    2026年6月23日

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  • R. Nandhakumar,
  • B. Anbarasan,
  • R. Manivannan,
  • M. Haridass

摘要

Modern electronic devices contain heat-generating microelectronic components that are typically exposed to high energy levels. These devices require rapid heat dissipation. However, to enhance the system’s heat management capabilities, significant efforts are needed to develop high-performance heat-transfer fluids. This experimental study explored the thermal performance of a copper minichannel heat sink using four nanofluids: TiO₂–water, Al₂O₃–water, MgO–water, and ZnO–water. The comparative thermal performance of a copper minichannel heat sink (30 mm × 30 mm × 4 mm) was evaluated under laminar flow conditions with nanofluids at volume fractions from 0.5% to 2.5%. A 7.93% enhancement in thermal conductivity was attained by dispersing Al₂O₃ nanoparticles at a 2.5% particle volume concentration in water. The Al₂O₃–water nanofluid demonstrated superior performance by reducing thermal resistance and friction factor in comparison to other nanofluids. The highest heat flux of 195.22 kW/m² was achieved by the Al₂O₃–water nanofluid at a 2.5% volume fraction and an inlet velocity of 0.1 m/s. Similarly, the lowest pressure drop and pumping power were 84.4 Pa and 0.00025 W, respectively. The comparative analysis showed that the Al₂O₃–water nanofluid exhibited better heat transfer performance and can be used as an effective minichannel heat sinks coolant for enhanced cooling applications.