<p>Electronic chip cooling mainly depends on high-aspect ratio fins along with cooling fan or cooling fluid, but it is subject to high density integration of electronic devices. Hence, a biophysical microchannel structure with microgrooves is proposed on heat sink surface. The objective is to explore how bionic and physical structure are combined to influence the heat dissipation of chip surface. By integrating bionic and physical behaviors along with microgrooves, spiral bionic and bio-topological microchannels were firstly designed and machined on heat sink surface, respectively. Then, heat dissipation energy was introduced through simulation to analyze heat conduction, heat convection and heat radiation. Finally, the chip heat dissipation was experimentally investigated with reference to chip power and fan wind speed. It is shown that the spiral bionic microchannel mainly perform heat convection rather than heat conduction and heat radiation, and produces larger heat dissipation energy of convection along with lower steady-state temperature than bionic microchannel and spiral microchannel, respectively. Further, the microgrooves applied on spiral bionic microchannel surface mainly performs the heat convection behavior for good chip heat dissipation. It decreases the steady-state temperature, and the reduction ratio increases with increasing chip power and decreasing wind speed. As a result, chip heat dissipation can be enhanced through surface structure optimization and microgrooves.</p>