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<p>As Insulated Gate Bipolar Transistor (IGBT) modules evolved toward higher integration and power ratings, increasingly stringent demands were placed on their thermal management capabilities. This study proposed a design featuring circular, triangular, square, pentagonal, hexagonal, and other differently shaped turbulence-inducing pillars integrated within the liquid cooling plate. The impact of different shapes of turbulence-inducing pillars on the heat dissipation performance and flow resistance of liquid cooling plates was investigated, with the number of bends and the parameters of the turbulence-inducing pillars serving as variables. By establishing an experimental platform, experimental data were compared with numerical simulation results. Based on computational fluid dynamics, the cooling performance of different models was analyzed. At a thermal power of 45&#xa0;W, the effects of fin shape, height, longitudinal and transverse spacing, and inlet/outlet quantities on the maximum temperature, average temperature, and pressure drop of the chip were investigated. When the height H of the flow-disturbing pillars was 2&#xa0;mm, the lateral spacing L was 1.8&#xa0;mm, and the longitudinal spacing K was 1.3&#xa0;mm, the model’s comprehensive evaluation index was improved by 4.6%. After adopting a one-inlet and two-outlet structure, the maximum chip temperature was reduced by 0.18&#xa0;°C, the pressure drop decreased by 66.99&#xa0;Pa, and the comprehensive evaluation index improved by 21.84%. The cooling performance of liquid cooling plates was affected by the mass flow rate of the coolant.</p>

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Experimental and numerical simulation study on heat transfer enhancement mechanism of IGBT module liquid-cooled plate based on multi-field synergy

  • 期刊论文

  • 发表日期：

    2026年2月26日

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  • Wanhao Han,
  • Weixue Cao,
  • Xiaoyu Zhang,
  • Jun Li,
  • Changxing Ren,
  • Chunyan Liu,
  • Zipeng Li,
  • Feng Shi

摘要

As Insulated Gate Bipolar Transistor (IGBT) modules evolved toward higher integration and power ratings, increasingly stringent demands were placed on their thermal management capabilities. This study proposed a design featuring circular, triangular, square, pentagonal, hexagonal, and other differently shaped turbulence-inducing pillars integrated within the liquid cooling plate. The impact of different shapes of turbulence-inducing pillars on the heat dissipation performance and flow resistance of liquid cooling plates was investigated, with the number of bends and the parameters of the turbulence-inducing pillars serving as variables. By establishing an experimental platform, experimental data were compared with numerical simulation results. Based on computational fluid dynamics, the cooling performance of different models was analyzed. At a thermal power of 45 W, the effects of fin shape, height, longitudinal and transverse spacing, and inlet/outlet quantities on the maximum temperature, average temperature, and pressure drop of the chip were investigated. When the height H of the flow-disturbing pillars was 2 mm, the lateral spacing L was 1.8 mm, and the longitudinal spacing K was 1.3 mm, the model’s comprehensive evaluation index was improved by 4.6%. After adopting a one-inlet and two-outlet structure, the maximum chip temperature was reduced by 0.18 °C, the pressure drop decreased by 66.99 Pa, and the comprehensive evaluation index improved by 21.84%. The cooling performance of liquid cooling plates was affected by the mass flow rate of the coolant.