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<p>This study addresses the critical need for advanced thermal management solutions in compact, foldable electronic devices, which face significant heat dissipation challenges due to their constrained form factors and dynamic structural configurations. The conventional thermal management techniques, such as rigid heat pipes and metallic thermal straps, often fail in flexibility, durability and effective heat transfer in foldable devices. This present study introduces a novel Flexible Heat Transfer Device (FHTD) designed with a fully metallic construction, integrating sintered copper wick structures and a flexible stainless steel bellow. This innovative approach ensures robust vacuum integrity and improved capillary performance, mitigating issues like non-condensable gas ingress common in polymer-metal hybrid designs. The FHTD is of length 630 mm and can transport up to 35 W of heat while keeping the evaporator temperature below <InlineEquation ID="IEq1"> <EquationSource Format="TEX">\(80^\circ C\)</EquationSource> </InlineEquation>. The design is modular; its dimensions and performance envelope can be tailored to suit specific end-use electronic thermal management. The experimental evaluation of the FHTD demonstrated exceptional thermal performance across various bending angles (<InlineEquation ID="IEq2"> <EquationSource Format="TEX">\(45^\circ\)</EquationSource> </InlineEquation>, <InlineEquation ID="IEq3"> <EquationSource Format="TEX">\(90^\circ\)</EquationSource> </InlineEquation>,<InlineEquation ID="IEq4"> <EquationSource Format="TEX">\(180^\circ\)</EquationSource> </InlineEquation>), achieving significantly lower thermal resistances (0.87 K/W at <InlineEquation ID="IEq5"> <EquationSource Format="TEX">\(45^\circ\)</EquationSource> </InlineEquation>) and higher effective thermal conductivity (up to 8193 W/m<InlineEquation ID="IEq6"> <EquationSource Format="TEX">\(\cdot\)</EquationSource> </InlineEquation>K). Compared to existing solutions, the developed FHTD offers substantial improvements in heat transport capability, flexibility and reliability, validating its suitability for foldable electronics.</p>

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Experimental investigation of a novel hermetically sealed two-phase flexible heat transfer device for foldable electronic devices

  • 期刊论文

  • 发表日期：

    2026年1月2日

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  • Kannan Pandi,
  • Jaganathan V M,
  • MuthuKumar C,
  • Suresh S

摘要

This study addresses the critical need for advanced thermal management solutions in compact, foldable electronic devices, which face significant heat dissipation challenges due to their constrained form factors and dynamic structural configurations. The conventional thermal management techniques, such as rigid heat pipes and metallic thermal straps, often fail in flexibility, durability and effective heat transfer in foldable devices. This present study introduces a novel Flexible Heat Transfer Device (FHTD) designed with a fully metallic construction, integrating sintered copper wick structures and a flexible stainless steel bellow. This innovative approach ensures robust vacuum integrity and improved capillary performance, mitigating issues like non-condensable gas ingress common in polymer-metal hybrid designs. The FHTD is of length 630 mm and can transport up to 35 W of heat while keeping the evaporator temperature below \(80^\circ C\) . The design is modular; its dimensions and performance envelope can be tailored to suit specific end-use electronic thermal management. The experimental evaluation of the FHTD demonstrated exceptional thermal performance across various bending angles ( \(45^\circ\) , \(90^\circ\) , \(180^\circ\) ), achieving significantly lower thermal resistances (0.87 K/W at \(45^\circ\) ) and higher effective thermal conductivity (up to 8193 W/m \(\cdot\) K). Compared to existing solutions, the developed FHTD offers substantial improvements in heat transport capability, flexibility and reliability, validating its suitability for foldable electronics.