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<p>Natural bamboo (NB) has inherent limitations, such as low thermal conductivity, tendency of hygroscopic expansion, and susceptibility to mold and mildew attack, which hampers its high value-added applications. This study developed high-performance bamboo-based polymer composites (BPC) by a delignification process combined with impregnation of AlN/BN-Epoxy resin. The thermal conductivity of BPC increased by 155.7% to 0.358&#xa0;W/(m·K), as compared with NB, whereas hydrophobic modification of the surface reduced the hygroscopic volume expansion to below 3%. Application of pressure optimized the distribution of resin and interfacial bonding that could achieve a tensile strength of 115.61&#xa0;MPa (10.2% increase compared to NB). Further, BPC showed improved thermal stability with peak pyrolysis temperature of 367.3&#xa0;°C. Micromorphological analysis confirmed that continuous thermally conductive networks were formed by the alignment of AlN/BN filler in the epoxy matrix. Meanwhile, X-ray photoelectron spectroscopy (XPS) showed the presence of hydrophobic C-F bonds on the modified surfaces. This multi-scale approach could successfully overcome the limitations of bamboo’s performance, endowing BPC with combined thermal capabilities, mechanical strength, and environmental durability. These advancements make BPC a sustainable alternative to conventional underfloor heating substrates and heat dissipation components.</p>

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Facile synthesis of high-performance bamboo-based polymer composites with better dimensional stability and enhanced thermal conductivity

  • 期刊论文

  • 发表日期：

    2025年9月11日

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  • Xin Tao,
  • Xiaoyang Fang,
  • Shuangshuang Wu,
  • Chuang Shao,
  • Wei Xu

摘要

Natural bamboo (NB) has inherent limitations, such as low thermal conductivity, tendency of hygroscopic expansion, and susceptibility to mold and mildew attack, which hampers its high value-added applications. This study developed high-performance bamboo-based polymer composites (BPC) by a delignification process combined with impregnation of AlN/BN-Epoxy resin. The thermal conductivity of BPC increased by 155.7% to 0.358 W/(m·K), as compared with NB, whereas hydrophobic modification of the surface reduced the hygroscopic volume expansion to below 3%. Application of pressure optimized the distribution of resin and interfacial bonding that could achieve a tensile strength of 115.61 MPa (10.2% increase compared to NB). Further, BPC showed improved thermal stability with peak pyrolysis temperature of 367.3 °C. Micromorphological analysis confirmed that continuous thermally conductive networks were formed by the alignment of AlN/BN filler in the epoxy matrix. Meanwhile, X-ray photoelectron spectroscopy (XPS) showed the presence of hydrophobic C-F bonds on the modified surfaces. This multi-scale approach could successfully overcome the limitations of bamboo’s performance, endowing BPC with combined thermal capabilities, mechanical strength, and environmental durability. These advancements make BPC a sustainable alternative to conventional underfloor heating substrates and heat dissipation components.