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<p>Cu/Ti composite joints are widely used in high-end equipment, and improving their interfacial bonding performance is of great practical significance. This work adopts a self-developed ultrasonic-assisted solid-phase consolidation method to bond Cu/Ti joints at 1023&#xa0;K with different ultrasonic amplitudes. Experimental results show that ultrasonic vibration effectively improves joint shear strength: the maximum value reaches 139.33&#xa0;MPa, much higher than 54.67&#xa0;MPa obtained via conventional thermal diffusion bonding. The increased diffusion layer thickness dominates the strength enhancement, which counteracts the adverse impact of brittle CuTi<sub>2</sub> intermetallic compounds. Excessive amplitude generates interfacial defects and reduces mechanical performance. Molecular dynamics simulations further verified the atomic diffusion behavior and interfacial stability evolution under ultrasonic vibration, revealing the intrinsic bonding mechanism.</p>

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Influence of ultrasonic vibration on interfacial bonding during solid-phase consolidation of Cu/Ti joints

  • 期刊论文

  • 发表日期：

    2026年8月3日

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  • Mao Zhang,
  • Qiaoan Yan,
  • Junru Shi,
  • Jiacheng Zhang,
  • Zehan Lei,
  • Yuxiang Yang,
  • Qiaomin Li,
  • Peng Guo,
  • Pan Gong,
  • Lei Deng,
  • Junsong Jin,
  • Xinyun Wang

摘要

Cu/Ti composite joints are widely used in high-end equipment, and improving their interfacial bonding performance is of great practical significance. This work adopts a self-developed ultrasonic-assisted solid-phase consolidation method to bond Cu/Ti joints at 1023 K with different ultrasonic amplitudes. Experimental results show that ultrasonic vibration effectively improves joint shear strength: the maximum value reaches 139.33 MPa, much higher than 54.67 MPa obtained via conventional thermal diffusion bonding. The increased diffusion layer thickness dominates the strength enhancement, which counteracts the adverse impact of brittle CuTi2 intermetallic compounds. Excessive amplitude generates interfacial defects and reduces mechanical performance. Molecular dynamics simulations further verified the atomic diffusion behavior and interfacial stability evolution under ultrasonic vibration, revealing the intrinsic bonding mechanism.