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Abstract <p>Magnetorheological polishing (MRP) has attracted growing interest due to its ability to produce highly consistent scratch morphologies, particularly on complex surfaces. However, the continuous influence of magnetic forces on the scratch depth and morphological profile of abrasive particles in coupling with pre-existing scratches of the workpiece surface in determining post-polishing quality remains poorly understood. Therefore, this study aim to clarify polishing behavior of copper - a typical soft metallic substrate, using core–shell <InlineEquation ID="IEq1"> <EquationSource Format="TEX">\(Fe_3O_4@SiO_2\)</EquationSource> </InlineEquation> abrasives is investigated using a hybrid FEM-MD simulation framework and a series of experiments using an in-house MRP system. Findings reveal that increasing the magnetic field strength enhanced the scratching depth and material removal efficiency. However, it reduced the uniformity of the scratch depth and increased the likelihood of abrasive particle entrapment within the workpiece surface. At a low magnetic force of 0.035 nN, pile-up distribution remains nearly isotropic, whereas higher forces (0.075 - 0.1 nN) promote pile-up alignment along the [110] crystallographic direction. Scratching along the close-packed [111] direction generates the highest density of partial dislocations, while [100] scratching produces the deepest shear bands and the most severe subsurface damage. Intrinsic stacking faults dominate, with extrinsic stacking faults emerging under strong magnetic loading due to abrasive collisions and interactions with pre-existing grooves. Experimentally, surface roughness is significantly reduced from <InlineEquation ID="IEq2"> <EquationSource Format="TEX">\(R_a\)</EquationSource> </InlineEquation> 11.5 ţm to 0.0065 ţm after sufficient polishing time.</p> Graphic abstract <p></p>

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Influence of magnetic-induced trajectory and morphology deformation of abrasives on depth uniformity and pile-up in magnetorheological polishing

  • 期刊论文

  • 发表日期：

    2026年7月29日

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  • Duy-Khanh Nguyen,
  • Dang-Duong Diem,
  • Duy-Trinh Nguyen,
  • Te-Hua Fang

摘要

Abstract

Magnetorheological polishing (MRP) has attracted growing interest due to its ability to produce highly consistent scratch morphologies, particularly on complex surfaces. However, the continuous influence of magnetic forces on the scratch depth and morphological profile of abrasive particles in coupling with pre-existing scratches of the workpiece surface in determining post-polishing quality remains poorly understood. Therefore, this study aim to clarify polishing behavior of copper - a typical soft metallic substrate, using core–shell \(Fe_3O_4@SiO_2\) abrasives is investigated using a hybrid FEM-MD simulation framework and a series of experiments using an in-house MRP system. Findings reveal that increasing the magnetic field strength enhanced the scratching depth and material removal efficiency. However, it reduced the uniformity of the scratch depth and increased the likelihood of abrasive particle entrapment within the workpiece surface. At a low magnetic force of 0.035 nN, pile-up distribution remains nearly isotropic, whereas higher forces (0.075 - 0.1 nN) promote pile-up alignment along the [110] crystallographic direction. Scratching along the close-packed [111] direction generates the highest density of partial dislocations, while [100] scratching produces the deepest shear bands and the most severe subsurface damage. Intrinsic stacking faults dominate, with extrinsic stacking faults emerging under strong magnetic loading due to abrasive collisions and interactions with pre-existing grooves. Experimentally, surface roughness is significantly reduced from \(R_a\) 11.5 ţm to 0.0065 ţm after sufficient polishing time.

Graphic abstract