<p>This study presents the fabrication of smart metallic components with embedded sensing using a self-developed Laser Foil Printing (LFP) additive manufacturing system and 316&#xa0;L stainless steel. Thin-film negative temperature coefficient (NTC) thermistors were integrated into the structure for in situ temperature monitoring, and a protective layer was introduced to limit thermal exposure to the embedded sensor during fabrication. The influence of the thermistor’s surface film was assessed by comparing film-intact and film-removed configurations. A process map derived from single-track experiments and machine-learning analysis enabled fabrication of high-density structures (relative density: 99.9%) and informed parameter selection for multilayer fabrication. A three-dimensional, multi-track finite-element thermal model predicted melt-pool dimensions within 10% of experimental measurements, supporting its use for process planning. Temperature measurements showed higher peaks for film-removed sensors (116.3&#xa0;°C vs. 71.6&#xa0;°C), indicating improved thermal coupling and a more direct thermal response. A Bluetooth module provided real-time wireless data transmission to mobile devices, facilitating remote monitoring during fabrication. The workflow integrates sensors, process mapping, physics-based modeling, and wireless telemetry into a coherent route toward instrumented metal parts. These results demonstrate the feasibility of LFP-based sensor integration for smart metallic components and offer a practical reference for smart manufacturing and high-performance parts.</p>

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Fabrication of smart metallic components for in-situ temperature monitoring by laser foil printing additive manufacturing

  • Yong Lin,
  • Hung-Chu Chiang,
  • Chia-Hung Hung

摘要

This study presents the fabrication of smart metallic components with embedded sensing using a self-developed Laser Foil Printing (LFP) additive manufacturing system and 316 L stainless steel. Thin-film negative temperature coefficient (NTC) thermistors were integrated into the structure for in situ temperature monitoring, and a protective layer was introduced to limit thermal exposure to the embedded sensor during fabrication. The influence of the thermistor’s surface film was assessed by comparing film-intact and film-removed configurations. A process map derived from single-track experiments and machine-learning analysis enabled fabrication of high-density structures (relative density: 99.9%) and informed parameter selection for multilayer fabrication. A three-dimensional, multi-track finite-element thermal model predicted melt-pool dimensions within 10% of experimental measurements, supporting its use for process planning. Temperature measurements showed higher peaks for film-removed sensors (116.3 °C vs. 71.6 °C), indicating improved thermal coupling and a more direct thermal response. A Bluetooth module provided real-time wireless data transmission to mobile devices, facilitating remote monitoring during fabrication. The workflow integrates sensors, process mapping, physics-based modeling, and wireless telemetry into a coherent route toward instrumented metal parts. These results demonstrate the feasibility of LFP-based sensor integration for smart metallic components and offer a practical reference for smart manufacturing and high-performance parts.