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<p>This study investigates the influence of die aspect ratio on epoxy molding compound (EMC) flow behaviour and structural reliability in wafer-level compression molding (WLCM). The aim is to understand how different aspect ratios affect filling, pressure distribution and deformation which provides design guidelines for reliable wafer-level encapsulation. A computational fluid dynamics (CFD) with finite element analysis (FEA) simulation framework is employed to model the transient EMC flow and subsequent structural deformation during WLCM. A three-dimensional (3D) geometry model was developed using the computer-aided design (CAD) tool ANSYS DesignModeler within ANSYS Workbench. The CAD models are meshed and simulated in ANSYS Fluent to analyse the mold flow behaviour. Additionally, the structural response was subsequently evaluated using ANSYS Transient Structural. Three die aspect ratios (0.5, 1, and 2) are examined by varying the die width while keeping the die length and thickness constant. The die aspect ratio significantly influences the EMC flow behaviour, pressure distribution and structural response. The 2 aspect ratio exhibits highest pressure build up and total deformation due to increase flow resistance. Meanwhile, 0.5 aspect ratio results greater stress concentration within the die due to geometric confinement. The 1 aspect ratio provides the most balanced behaviour with a symmetric flow front and moderate deformation. This paper addresses the need for the CFD and structural analysis to investigate EMC flow behaviour and structural response in WLCM which provides new insights into die geometry effects on encapsulation reliability in advanced semiconductor packaging.</p>

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Effects of die aspect ratio on mold flow and structural behaviour in wafer-level encapsulation process

  • 期刊论文

  • 发表日期：

    2026年6月23日

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  • Ainnur Hanim Othman,
  • Ooi Teng Qing,
  • Mohd Sharizal Abdul Aziz,
  • Mohammad Hafifi Hafiz Ishak,
  • Muhammad Naqib Nashrudin,
  • Muhammad Aqil Azman

摘要

This study investigates the influence of die aspect ratio on epoxy molding compound (EMC) flow behaviour and structural reliability in wafer-level compression molding (WLCM). The aim is to understand how different aspect ratios affect filling, pressure distribution and deformation which provides design guidelines for reliable wafer-level encapsulation. A computational fluid dynamics (CFD) with finite element analysis (FEA) simulation framework is employed to model the transient EMC flow and subsequent structural deformation during WLCM. A three-dimensional (3D) geometry model was developed using the computer-aided design (CAD) tool ANSYS DesignModeler within ANSYS Workbench. The CAD models are meshed and simulated in ANSYS Fluent to analyse the mold flow behaviour. Additionally, the structural response was subsequently evaluated using ANSYS Transient Structural. Three die aspect ratios (0.5, 1, and 2) are examined by varying the die width while keeping the die length and thickness constant. The die aspect ratio significantly influences the EMC flow behaviour, pressure distribution and structural response. The 2 aspect ratio exhibits highest pressure build up and total deformation due to increase flow resistance. Meanwhile, 0.5 aspect ratio results greater stress concentration within the die due to geometric confinement. The 1 aspect ratio provides the most balanced behaviour with a symmetric flow front and moderate deformation. This paper addresses the need for the CFD and structural analysis to investigate EMC flow behaviour and structural response in WLCM which provides new insights into die geometry effects on encapsulation reliability in advanced semiconductor packaging.