<p>Monocrystalline silicon is widely used in chip and photovoltaic manufacturing. However, processing monocrystalline silicon is difficult due to its high hardness and brittleness. An innovational technology of immersion fluid free abrasive assisted wire sawing (IFAWS) is proposed in this paper, which has the potential to reduce the sawing force on the wire saw and improve the surface quality of workpieces. Firstly, the mechanism of the hydrodynamic pressure effect generated in the process of IFAWS of monocrystalline silicon and its impact on the processing quality are investigated. Secondly, the surface topography of monocrystalline silicon wafers is simulated using MATLAB and validated through experimentation. Finally, to study the sawing force during IFAWS of monocrystalline silicon under different process parameters and the surface quality of the processed workpiece, the experiment about IFAWS is conducted. The experimental results show that the macroscopic sawing force on the diamond wire saw decreases with the axial speed of the saw wire and the diameter of the free abrasive and increases with the feed speed of wire saw; the surface quality of the processed workpiece increases with the axial speed of the saw wire and the diameter of the free abrasive, and decreases with the feed speed of wire saw.</p>