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<p>This study investigates the laser micromachining of silicon in pressurized and flowing water environments, focusing on the effects of water flow rate and pressure on groove dimensions and surface quality. A nanosecond-pulse laser was utilized to fabricate grooves under varying water-assisted conditions. Results demonstrated that higher water flow rates and pressures significantly improved surface quality by minimizing thermal damage, recast layer formation, and redeposition of molten material. Groove width decreased with increasing water flow rate and pressure, narrowing from approximately 231.6&#xa0;μm to 187.4&#xa0;μm. This reduction is attributed to the suppression of cavitation bubble size and persistence under high-pressure conditions, which minimizes optical beam scattering and leads to more localized ablation. Conversely, groove depth increased significantly from 34.6&#xa0;μm to 115.7&#xa0;μm, as intensified shock waves from violent bubble collapse and efficient debris flushing facilitated greater vertical material removal. Analysis of variance confirmed that both parameters and their interaction are statistically significant, with water pressure identified as the most influential factor. Furthermore, the process efficiency, characterized by the material removal rate, was substantially enhanced under these high-hydrodynamic conditions. These findings highlight the importance of hydrodynamic parameters in controlling groove geometry and achieving good surface integrity for micromachining applications.</p>

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Laser micromachining of silicon in pressurized and flowing water

  • 期刊论文

  • 发表日期：

    2026年1月29日

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  • Wisan Charee,
  • Huan Qi,
  • Hao Zhu,
  • Viboon Saetang

摘要

This study investigates the laser micromachining of silicon in pressurized and flowing water environments, focusing on the effects of water flow rate and pressure on groove dimensions and surface quality. A nanosecond-pulse laser was utilized to fabricate grooves under varying water-assisted conditions. Results demonstrated that higher water flow rates and pressures significantly improved surface quality by minimizing thermal damage, recast layer formation, and redeposition of molten material. Groove width decreased with increasing water flow rate and pressure, narrowing from approximately 231.6 μm to 187.4 μm. This reduction is attributed to the suppression of cavitation bubble size and persistence under high-pressure conditions, which minimizes optical beam scattering and leads to more localized ablation. Conversely, groove depth increased significantly from 34.6 μm to 115.7 μm, as intensified shock waves from violent bubble collapse and efficient debris flushing facilitated greater vertical material removal. Analysis of variance confirmed that both parameters and their interaction are statistically significant, with water pressure identified as the most influential factor. Furthermore, the process efficiency, characterized by the material removal rate, was substantially enhanced under these high-hydrodynamic conditions. These findings highlight the importance of hydrodynamic parameters in controlling groove geometry and achieving good surface integrity for micromachining applications.