<p>Ceramic matrix composites (CMCs) are highly promising for the hot components of the aero-engines due to their high-temperature resistance and low density. The fibers of CMCs are woven into different structures to meet the specific requirements of heat and stress load. However, the influence of the woven structure on the precision machining remains unknown. This study investigates the material removal behaviors of SiC<sub>f</sub>/SiC with different woven structures (0º/90º, 30º/60º, 45º/45º, 60º/30º, 90º/0º) via single diamond scratching experiments. The scratched surface morphologies and scratching forces are carefully analyzed. The finite element method is also adopted to analyze the stress distribution. Results show that woven structures influence the distribution of side scratching damage: 0°/90° and 90°/0° exhibit symmetric damage, while 30°/60°, 45°/45°, and 60°/30° show asymmetric damage. Side scratching damage increases with the scratching depth, with the minimum damage of 94&#xa0;μm at 30°/60° and the maximum damage of 452.4&#xa0;μm at 90°/0°. Different stress distributions induced by woven structures lead to smooth, stepped, and broken fiber fractures. When the scratching depth increases from 5&#xa0;μm to 20&#xa0;μm, the scratching force increases by 112.9% for 30°/60° and 60°/30°, 302.9% for 45°/45°, and 337% for 0°/90° and 90°/0°. However, the presence of pore defects reduces the scratching force and causes force fluctuations. The stress propagates along the interfaces and between adjacent fibers in all woven structures. When the stress exceeds the material’s strength limit, cracks initiate and propagate, ultimately resulting in material removal. This study provides theoretical support for SiC<sub>f</sub>/SiC machining.</p>

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Study on single diamond scratching of woven SiCf/SiC composites: surface morphology, force, and stress distribution

  • Gaofeng Liu,
  • Pengfei Xu,
  • Yuting Sun,
  • Jingfei Yin,
  • Wenfeng Ding,
  • Honghua Su,
  • Jiuhua Xu

摘要

Ceramic matrix composites (CMCs) are highly promising for the hot components of the aero-engines due to their high-temperature resistance and low density. The fibers of CMCs are woven into different structures to meet the specific requirements of heat and stress load. However, the influence of the woven structure on the precision machining remains unknown. This study investigates the material removal behaviors of SiCf/SiC with different woven structures (0º/90º, 30º/60º, 45º/45º, 60º/30º, 90º/0º) via single diamond scratching experiments. The scratched surface morphologies and scratching forces are carefully analyzed. The finite element method is also adopted to analyze the stress distribution. Results show that woven structures influence the distribution of side scratching damage: 0°/90° and 90°/0° exhibit symmetric damage, while 30°/60°, 45°/45°, and 60°/30° show asymmetric damage. Side scratching damage increases with the scratching depth, with the minimum damage of 94 μm at 30°/60° and the maximum damage of 452.4 μm at 90°/0°. Different stress distributions induced by woven structures lead to smooth, stepped, and broken fiber fractures. When the scratching depth increases from 5 μm to 20 μm, the scratching force increases by 112.9% for 30°/60° and 60°/30°, 302.9% for 45°/45°, and 337% for 0°/90° and 90°/0°. However, the presence of pore defects reduces the scratching force and causes force fluctuations. The stress propagates along the interfaces and between adjacent fibers in all woven structures. When the stress exceeds the material’s strength limit, cracks initiate and propagate, ultimately resulting in material removal. This study provides theoretical support for SiCf/SiC machining.