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<p>In-Mold Electronics (IME) integrates printed electronics into 3D-molded polymer parts, to produce lightweight, functional and easy to assemble devices. IME makes use of conductive inks that require heat curing making the process not well adapted for low glass transition (Tg) temperature polymers. This study presents the adaptation of IME to Poly(Lactic Acid) (PLA), a biosourced, and biodegradable polymer, replacing traditional heat curing with photonic curing. Characteristics of the electronic circuit using both curing methods were compared for PLA and Polycarbonate. The use of pulsed light heats locally conductive inks and adhesives preventing deforming or degrading the polymer substrate due to PLA’s low Tg temperature. Our approach ensured high electrical conductivity of ME603 silver ink and ME902 conductive adhesive while maintaining conductive track continuity after stretching by thermoforming of PLA. Fully functional IME demonstrators present potential applications. This work highlights photonic curing’s capability for enabling sustainable electronics manufacturing with recyclable polymers, maintaining performance, and reducing production time.</p>

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In-Mold electronics with high electrical conductivity circuits on Poly(Lactic Acid) and polycarbonate using photonic curing

  • 期刊论文

  • 发表日期：

    2025年11月18日

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  • Tony Gerges,
  • Hugo Cauchy-Clerc,
  • Philippe Lombard,
  • Jean-Yves Charmeau,
  • Bruno Allard,
  • Michel Cabrera

摘要

In-Mold Electronics (IME) integrates printed electronics into 3D-molded polymer parts, to produce lightweight, functional and easy to assemble devices. IME makes use of conductive inks that require heat curing making the process not well adapted for low glass transition (Tg) temperature polymers. This study presents the adaptation of IME to Poly(Lactic Acid) (PLA), a biosourced, and biodegradable polymer, replacing traditional heat curing with photonic curing. Characteristics of the electronic circuit using both curing methods were compared for PLA and Polycarbonate. The use of pulsed light heats locally conductive inks and adhesives preventing deforming or degrading the polymer substrate due to PLA’s low Tg temperature. Our approach ensured high electrical conductivity of ME603 silver ink and ME902 conductive adhesive while maintaining conductive track continuity after stretching by thermoforming of PLA. Fully functional IME demonstrators present potential applications. This work highlights photonic curing’s capability for enabling sustainable electronics manufacturing with recyclable polymers, maintaining performance, and reducing production time.