<p>Monocrystalline silicon, with its outstanding physical and chemical properties, plays an indispensable role in advanced manufacturing. However, due to its hard, brittle and difficult-to-conductive properties, it is difficult to keep a good balance between processing accuracy and efficiency in traditional mechanical processing techniques. To this end, we develop a novel electrochemical discharge–assisted micro-grinding (ECD-MG) method that enables the precision Machining of monocrystalline silicon via a combination of electrochemical etching, discharge and mechanical removal. By decoupling physical grinding and electrochemical action, the key factors of the formation of sodium silicate modified layer under electrochemical action are found out, to improve the efficiency and quality of micro-grinding. Based on the investigation of surface roughness, overcutting and surface damage in micro-grooves, the effects of working voltage, feed speed, pulse frequency and micro-grinding speed on Machining quality are revealed. The multi-objective decision analysis in the ECD-MG process shows that the optimal surface quality is obtained at the feed rates of 46 V, rotating speed of 15,000 rpm, frequency of 6000 Hz and feed rate of 15 μm/s, indicating the high efficiency and high quality fixed-area machining of ECD-MG technology for hard, brittle and difficult-to-conductive materials.</p>