<p>A novel magnetic surface finishing process has been proposed to enhance the stability and polishing efficiency for materials used in optical and semiconductor applications. This process leverages the combination of a multipole magnetic field during the use of cutting fluid. A 567 mT magnetic field not only ensures stability but also minimizes the abrasive particle sedimentation during the processing. This study provides a detailed insight into the spatial variation of the magnetic field within the machining zone while analyzing the behavior of abrasive particles subjected to the effects of the multipole magnetic field. Additionally, a theoretical framework for normal and tangential forces is established to understand the force mechanism in this method. Furthermore, crucial parameters that directly impact the interaction force and workpiece surface quality, including the distance during polishing, the size of abrasive particles, and the concentration of SiO₂ in the shear fluid, are thoroughly examined. Experimental results demonstrate that polishing force and surface quality Significantly change when these parameters are adjusted. Through practical tests, the surface of SiC Materials has been Significantly enhanced, as evidenced by the reduction in initial surface roughness Ra from 184.73 to 1.06&#xa0;nm after processing using the multipole magnetic yoke method. This confirms the superior efficiency of the method and provides a broader perspective on its potential applications in precision machining.</p>