Three-dimensional modeling and experimental analysis of diamond fly-cutting for anti-reflective microgroove arrays on BK7 glass
摘要
This study established a three-dimensional fly-cutting model considering tool geometry to calculate instantaneous undeformed chip thickness and derived a maximum undeformed chip thickness formula across a complete cutting cycle. Single-factor experiments on BK7 glass explored the effects of machining parameters and tool geometries on surface integrity, revealing that higher rotational speeds and lower feed rates mitigate sidewall collapse and crack propagation. Orthogonal experiments revealed feed rate as the dominant factor affecting machining quality, with spindle speed and cutting depth exhibiting comparable influence, while tool rake angle showed minimal impact. Box-Behnken-derived regression model achieved exceptional accuracy (R2 = 0.9863), and analysis of the model confirmed significant interactions between machining parameters. Furthermore, anti-reflective microgroove arrays with duty cycles of 44.82% and 56.52% were fabricated, exhibiting reduced reflectivity and enhanced light transmittance under large-angle incidence. Optical characterization confirms that structured surfaces outperform unstructured surface in anti-reflective performance, with duty cycle modulation enabling tailored light-guiding properties. These findings provide critical insights for optimizing fly-cutting parameters in high-precision optical microstructure fabrication.