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<p>The distribution of the flow field plays a crucial role in determining the processing stability and accuracy in maskless electrochemical machining (ECM) of microstructure arrays. This paper addresses the challenge of uneven flow field distribution in maskless ECM of microstructure arrays by utilizing an electrolyte dividing manifold to design and optimize a new flow field known as the interleaved parallel jets (IPJ). The simulation results reveal that the IPJ, compared to the traditional lateral flow field, demonstrates reduced variance in velocity distribution, achieves more uniform flow field distribution, and increases the average velocity by 70.25%. Two metrics, surface roughness and groove width overcut, are identified as indicators of surface quality and machining locality. The machining voltage <i>U</i>, pulse duty cycle <i>ε</i>, and cathode feed rate <i>v</i> were selected as the parameters to be optimized. Using the response surface methodology, the optimal machining parameters were identified, and two functions were developed for the objective. Finally, using an optimized IPJ model under optimal parameter conditions, various microstructure arrays were fabricated through maskless ECM. The process exhibited excellent stability and surface quality, showcasing the significant advantages of IPJ in maskless ECM of microstructure arrays.</p>

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Investigation of flow field in microstructure arrays electrochemical machining with interleaved parallel jets

  • 期刊论文

  • 发表日期：

    2025年8月18日

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  • Huihui Sun,
  • Wanfei Ren,
  • Jinkai Xu,
  • Haoran Deng,
  • Fan Tong,
  • Jinpeng Zhao

摘要

The distribution of the flow field plays a crucial role in determining the processing stability and accuracy in maskless electrochemical machining (ECM) of microstructure arrays. This paper addresses the challenge of uneven flow field distribution in maskless ECM of microstructure arrays by utilizing an electrolyte dividing manifold to design and optimize a new flow field known as the interleaved parallel jets (IPJ). The simulation results reveal that the IPJ, compared to the traditional lateral flow field, demonstrates reduced variance in velocity distribution, achieves more uniform flow field distribution, and increases the average velocity by 70.25%. Two metrics, surface roughness and groove width overcut, are identified as indicators of surface quality and machining locality. The machining voltage U, pulse duty cycle ε, and cathode feed rate v were selected as the parameters to be optimized. Using the response surface methodology, the optimal machining parameters were identified, and two functions were developed for the objective. Finally, using an optimized IPJ model under optimal parameter conditions, various microstructure arrays were fabricated through maskless ECM. The process exhibited excellent stability and surface quality, showcasing the significant advantages of IPJ in maskless ECM of microstructure arrays.