<p>Fused silica is highly prone to surface and subsurface damage (SSD) during grinding, which significantly influences subsequent polishing processes. This paper, based on fracture mechanics theory and the kinematic relationship between abrasives and the workpiece during grinding, analyzes the potential material removal and surface formation modes in the grinding process. Additionally, the corresponding critical conditions for each material removal mode are established. To gain a deeper understanding of the evolution mechanism of surface and subsurface damage in fused silica during grinding, this study investigates the impact of various grinding process parameters on the surface and subsurface damage micro-characteristics. Experimental results indicate that the ground surface of fused silica becomes progressively more regular, with surface roughness (<i>S</i>_a and <i>S</i>_z) decreasing from initial values of 1601 nm and 12.6 µm to 22.27 nm and 0.97 µm, respectively. And the subsurface damage depth is ultimately controlled to 1.67 µm. By comparing and analyzing the surface and subsurface morphology formed at different grinding stages, this study explores the evolution mechanism of surface and subsurface micro-characteristics induced by grinding. Furthermore, it examines how process parameters significantly affect the material damage modes, providing a basis for precisely controlling the grinding process and optimizing process parameters, with the goal of reducing or preventing potential surface and subsurface damage in fused silica grinding.</p>