Material removal mechanisms during ultrasonic vibration-assisted grinding of WC-10Co-4Cr coatings with a single diamond grain
摘要
WC-10Co-4Cr coating is widely used in aerospace wear-resistant parts due to its excellent hardness, wear resistance, and corrosion resistance. However, the coating produced with high-velocity oxygen fuel (HVOF) has a high surface roughness (4–6 µm) and requires subsequent grinding. Due to its extremely high hardness, conventional grinding (CG) tends to lead to excessive grinding forces and poor surface quality, while ultrasonic vibration-assisted grinding (UVAG) can effectively improve the grinding performance of brittle materials by applying high-frequency vibrations. This paper elucidates the material removal mechanism of the WC-10Co-4Cr coating through systematic single diamond comparative experiments, focusing on aspects such as grinding force, quantification of brittle removal ratio, and analysis of subsurface crack depth. The main findings indicate that the application of tangential ultrasonic vibration to the WC-10Co-4Cr coating reduced the grinding force of single diamond grain by 4.28–61%. UVAG enhances the surface morphology of scratches, decreasing the brittle removal rate at the bottom of scratches and the area of edge peeling. UVAG reduces the crack depth and alters the crack direction, decreasing the subsurface damage depth from 37 to 31 µm, ultimately improving the grinding quality of the WC-10Co-4Cr coating.