Full seamless copper substrate accelerator cavity manufactured by tube hydroforming
摘要
We successfully prototyped the world’s first 1.3 GHz one-cell full seamless copper cavity through tube hydroforming in 2023. Extensive research has been conducted to manufacture an accelerator cavity body from copper and coat it with niobium to provide superconductivity. The inner surface of the cavity must be smooth and a seamless cavity is an ideal substrate for coating. A full seamless cavity presents lower cost and better quality than the conventional niobium-coated cavities with seams. In this study, we established a manufacturing process for a full seamless cavity using two-step tube hydroforming and used simulations to determine the forming conditions. The initial seamless tube comprised oxygen-free copper and had an outer diameter of 88 mm. The target diameter of the cavity center must be expanded by 2.4 times. There are no industrial applications of expanding to such a large extent by hydroforming. The forming times for the two steps were 51 s and 78 s, respectively, and the cavity was formed exceptionally quickly. The wall thickness distribution after forming was predicted using a simulation. The experimental and simulation results concurred well for a friction coefficient of 0.2.