<p>Additive manufacturing underpins Industry 4.0. Polylactic acid (PLA) is an emerging biopolymer with excellent mechanical properties and biodegradability. Long-term performance of 3D printed PLA is essentially required in various fields such as automobile, aerospace, biomedical, and packaging. Dynamic mechanical analysis (DMA) and creep analysis were performed to disclose various trends of 3D printed PLA by varying temperature with time and frequency being constant. It is also anticipated that DMPs such as tan δ, creep compliance, relaxation modulus, and static mechanical property (SMP) such as hardness of 3D printed PLA, may largely be affected by material extrusion additive manufacturing (MEX) factors utilized. Impact of MEX factors namely layer height, extrusion temperature, and number (No.) of contours is thoroughly investigated employing Taguchi L9 orthogonal array. Of the analysis of variance (Anova), significance of MEX factors was identified for a range of DMA testing temperature (DTTs) (40 to 55&#xa0;°C). Though MEX factors were found to be insignificant towards response parameters, i.e., DMPs except tan δ at DTT of 45&#xa0;°C, optimum value of tan δ was achieved to be 1.385 for DTTs range between 40&#xa0;°C and 65&#xa0;°C, the optimal value of creep compliance of 0.000048&#xa0;MPa-1 was achieved at 50&#xa0;°C, optimum value of relaxation modulus was found to be 19768.47&#xa0;MPa at 50&#xa0;°C, and optimal value of hardness was achieved to be 78.93 HA at room temperature delivering a considerable improvement of 3077%, 7.9E05%, 685%, and 65.96% respectively, as compared to previous studies. Porosities of 3D printed samples were found in a range (31–35) %. Moreover, 3D printed samples were also examined microscopically after getting DMPs and SMP quantified to reveal various interesting facts, e.g., layer height variations, layer waviness, dimensional inaccuracies, and pre-bending restricting DMPs and SMP from further enhancement.</p>

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Optimizing the dynamic and static mechanical properties of 3D printed polylactic acid (PLA)

  • Syed Farhan Raza,
  • Adeel Shehzad,
  • Kashif Ishfaq,
  • Muhammad Taskeen Raza,
  • Syed Mustafa Haider,
  • Ahmed Murtaza Mehdi

摘要

Additive manufacturing underpins Industry 4.0. Polylactic acid (PLA) is an emerging biopolymer with excellent mechanical properties and biodegradability. Long-term performance of 3D printed PLA is essentially required in various fields such as automobile, aerospace, biomedical, and packaging. Dynamic mechanical analysis (DMA) and creep analysis were performed to disclose various trends of 3D printed PLA by varying temperature with time and frequency being constant. It is also anticipated that DMPs such as tan δ, creep compliance, relaxation modulus, and static mechanical property (SMP) such as hardness of 3D printed PLA, may largely be affected by material extrusion additive manufacturing (MEX) factors utilized. Impact of MEX factors namely layer height, extrusion temperature, and number (No.) of contours is thoroughly investigated employing Taguchi L9 orthogonal array. Of the analysis of variance (Anova), significance of MEX factors was identified for a range of DMA testing temperature (DTTs) (40 to 55 °C). Though MEX factors were found to be insignificant towards response parameters, i.e., DMPs except tan δ at DTT of 45 °C, optimum value of tan δ was achieved to be 1.385 for DTTs range between 40 °C and 65 °C, the optimal value of creep compliance of 0.000048 MPa-1 was achieved at 50 °C, optimum value of relaxation modulus was found to be 19768.47 MPa at 50 °C, and optimal value of hardness was achieved to be 78.93 HA at room temperature delivering a considerable improvement of 3077%, 7.9E05%, 685%, and 65.96% respectively, as compared to previous studies. Porosities of 3D printed samples were found in a range (31–35) %. Moreover, 3D printed samples were also examined microscopically after getting DMPs and SMP quantified to reveal various interesting facts, e.g., layer height variations, layer waviness, dimensional inaccuracies, and pre-bending restricting DMPs and SMP from further enhancement.