Scholarlink

<p><i>Electroforming</i> emerges as a pivotal and cost-efficient technology, transforming products not only by enhancing their resistance to corrosion but also by elevating their aesthetic appeal. This process applies a precisely controlled metal layer onto a substrate through Electrodeposition, yielding a robust, visually striking finish. In this paper, we unveil a <i>cutting-edge modeling approach for simulating the Electrodeposition process in Printed Circuit Board</i> (PCB) <i>manufacturing</i>, leveraging the capabilities of <i>COMSOL Multiphysics: Electrodeposition Module</i>. Our innovative methodology involves a thorough investigation of how varying process parameters influence the deposition’s weight and thickness, thereby ensuring the precision and reliability of our numerical simulations.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Next-generation printed circuit boards manufacturing: an innovative numerical investigation using electroforming process

  • 期刊论文

  • 发表日期：

    2025年3月21日

查看全文
  • Ilhem Boutana,
  • Mohamed Rachid Mekideche,
  • Oussama Boultif,
  • Abdessalam Zait

摘要

Electroforming emerges as a pivotal and cost-efficient technology, transforming products not only by enhancing their resistance to corrosion but also by elevating their aesthetic appeal. This process applies a precisely controlled metal layer onto a substrate through Electrodeposition, yielding a robust, visually striking finish. In this paper, we unveil a cutting-edge modeling approach for simulating the Electrodeposition process in Printed Circuit Board (PCB) manufacturing, leveraging the capabilities of COMSOL Multiphysics: Electrodeposition Module. Our innovative methodology involves a thorough investigation of how varying process parameters influence the deposition’s weight and thickness, thereby ensuring the precision and reliability of our numerical simulations.