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<p>Grinding machining has been the current research focus for the efficient removal and defect suppression of ceramic materials such as C/SiC. However, tool wear and machining efficiency restrict the rapid development of the grinding machining process. Therefore, this paper proposes the combination of short electric arc milling (SEAM) and grinding to explore new machining and defect suppression methods. The results indicate that matrix microcracks, fiber damage, and recast layers are the main defects induced by SEAM. Through the selection of appropriate power output parameters, surface defects can be further reduced, and workpiece quality can be improved. Additionally, compared with copper and graphite, copper–tungsten alloy exhibits a higher melting point and wear resistance, making it more suitable for the SEAM of 2.5-dimensional (2.5D) C/SiC composites. Carbon fiber as a reinforcing phase promotes arc discharge but also leads to single-pulse multi-point discharges, resulting in a “hump” waveform. Taking into account the advantages of mechanical grinding, a spindle speed of 1500&#xa0;r/min effectively suppresses arc discharge defects, further enhancing workpiece quality. This paper proposes a new discharge machining method and defect suppression approach for 2.5D C/SiC composites. The proposed techniques and methods can provide valuable guidance for improving the processing quality of 2.5D-C/SiC composites.</p>

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Research on the short electric arc milling performance and defect suppression method of 2.5-dimensional C/SiC composites

  • 期刊论文

  • 发表日期：

    2025年2月17日

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  • Bingbing Wang,
  • Jianping Zhou,
  • Hongwang Ma,
  • Yuan Yu,
  • Shengwei Ding,
  • Xiaokang Chen,
  • Yan Xu

摘要

Grinding machining has been the current research focus for the efficient removal and defect suppression of ceramic materials such as C/SiC. However, tool wear and machining efficiency restrict the rapid development of the grinding machining process. Therefore, this paper proposes the combination of short electric arc milling (SEAM) and grinding to explore new machining and defect suppression methods. The results indicate that matrix microcracks, fiber damage, and recast layers are the main defects induced by SEAM. Through the selection of appropriate power output parameters, surface defects can be further reduced, and workpiece quality can be improved. Additionally, compared with copper and graphite, copper–tungsten alloy exhibits a higher melting point and wear resistance, making it more suitable for the SEAM of 2.5-dimensional (2.5D) C/SiC composites. Carbon fiber as a reinforcing phase promotes arc discharge but also leads to single-pulse multi-point discharges, resulting in a “hump” waveform. Taking into account the advantages of mechanical grinding, a spindle speed of 1500 r/min effectively suppresses arc discharge defects, further enhancing workpiece quality. This paper proposes a new discharge machining method and defect suppression approach for 2.5D C/SiC composites. The proposed techniques and methods can provide valuable guidance for improving the processing quality of 2.5D-C/SiC composites.