Scholarlink

<p>The presented work is a study on additively manufactured electronics, specifically focusing on optimizing inkjet printing strategies for low-impedance electrically conductive structures in insulating housings, which has the ability to change the way electronics look like. It integrates computational fluid dynamics to simulate the printing process and machine learning algorithms to analyze the high-dimensional parameter space of the simulation results. The study investigates the influence of various material properties and manufacturing parameters on a new, multi-layer-based printing approach, named droplet stacking, which can be beneficial to smoothen the outline of electrically conductive structures. The results indicate a potential for significantly steeper droplet stacking angles, increasing from 63 to 85°, and identify contact angle, droplet velocity, and viscosity as the most important parameters influencing the droplet stacking capabilities. Optimizing these parameters can smooth the conductor’s outline to improve its high-frequency properties.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Enhancing electrical high-frequency performance by an optimized additive manufacturing strategy

  • 期刊论文

  • 发表日期：

    2025年1月11日

查看全文
  • Tobias Hehn,
  • Felix Zimmer,
  • Markus Klein,
  • Jens Holtmannspötter

摘要

The presented work is a study on additively manufactured electronics, specifically focusing on optimizing inkjet printing strategies for low-impedance electrically conductive structures in insulating housings, which has the ability to change the way electronics look like. It integrates computational fluid dynamics to simulate the printing process and machine learning algorithms to analyze the high-dimensional parameter space of the simulation results. The study investigates the influence of various material properties and manufacturing parameters on a new, multi-layer-based printing approach, named droplet stacking, which can be beneficial to smoothen the outline of electrically conductive structures. The results indicate a potential for significantly steeper droplet stacking angles, increasing from 63 to 85°, and identify contact angle, droplet velocity, and viscosity as the most important parameters influencing the droplet stacking capabilities. Optimizing these parameters can smooth the conductor’s outline to improve its high-frequency properties.