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<p>In this study, <i>Eucalyptus urophylla × grandis</i> particles were used as the raw materials and poly-4,4′-diphenylmethane diisocyanate (pMDI) served as the adhesive. A two-way experimental design was employed to systematically investigate the combined effects of particle moisture content (PMC, 3%, 6%, 9%, and 12%) and resin content (RC, 3%, 6%, and 9%) on the physical and mechanical properties of particleboard. Fluorescence microscopy and digital image correlation (DIC) were integrated to elucidate the structure-property relationships between bonding interface characteristics and board-level mechanical behavior. The results showed that a balanced combination of PMC and RC markedly improved the bonding quality and overall performance of particleboard. Optimal performance was achieved at 9% PMC and 3% RC, where all mechanical and dimensional stability indicators met the GB/T 4897 − 2015 P2 type standard. Fluorescence microscopy revealed that moderate increase in PMC and RC enhanced adhesive dispersion and promoted the formation of a continuous three-dimensional bonding network at the particle interface. DIC analysis further indicated that optimized bonding conditions led to more homogeneous strain distribution and reduced localized shear concentration during bending. These findings provide fundamental insights into the interfacial mechanisms governing pMDI-bonded particleboard performance and offer valuable guidance for the design and production of high-performance, moisture-adaptive particleboard.</p>

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Investigation of bonding interface structure-property relationships in particleboard using fluorescence microscopy and digital image correlation

  • 期刊论文

  • 发表日期：

    2026年1月8日

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  • Keying Long,
  • Weiye Lu,
  • Xi Pan,
  • Xinzhou Wang,
  • Zijing Guo,
  • Limin Peng,
  • Junfeng Wang

摘要

In this study, Eucalyptus urophylla × grandis particles were used as the raw materials and poly-4,4′-diphenylmethane diisocyanate (pMDI) served as the adhesive. A two-way experimental design was employed to systematically investigate the combined effects of particle moisture content (PMC, 3%, 6%, 9%, and 12%) and resin content (RC, 3%, 6%, and 9%) on the physical and mechanical properties of particleboard. Fluorescence microscopy and digital image correlation (DIC) were integrated to elucidate the structure-property relationships between bonding interface characteristics and board-level mechanical behavior. The results showed that a balanced combination of PMC and RC markedly improved the bonding quality and overall performance of particleboard. Optimal performance was achieved at 9% PMC and 3% RC, where all mechanical and dimensional stability indicators met the GB/T 4897 − 2015 P2 type standard. Fluorescence microscopy revealed that moderate increase in PMC and RC enhanced adhesive dispersion and promoted the formation of a continuous three-dimensional bonding network at the particle interface. DIC analysis further indicated that optimized bonding conditions led to more homogeneous strain distribution and reduced localized shear concentration during bending. These findings provide fundamental insights into the interfacial mechanisms governing pMDI-bonded particleboard performance and offer valuable guidance for the design and production of high-performance, moisture-adaptive particleboard.